• DocumentCode
    2371681
  • Title

    Test chip fabrication with extreme ultraviolet lithography for high-volume manufacturing

  • Author

    Mori, I. ; Aoyama, H.

  • Author_Institution
    Semicond. Leading Edge Technol., Inc. (Selete), Tsukuba, Japan
  • fYear
    2010
  • fDate
    6-8 Dec. 2010
  • Abstract
    Since launching the project to get extreme ultraviolet lithography (EUVL) ready for production, we focused on two issues: test chip fabrication down to a half pitch (hp) of 28 nm to assess an applicability of EUVL to the fabrication of logic devices (BEOL test chip); and the manufacturability of EUVL, for which we used a special PL test site to assess the electrical yield. Furthermore, we examined the potential of EUVL for device fabrication at sizes beyond hp 24 nm.
  • Keywords
    nanofabrication; semiconductor device manufacture; ultraviolet lithography; BEOL test chips; EUVL; back-end-of-line test chip; electrical yield; extreme ultraviolet lithography; high-volume manufacturing; logic devices; test chip fabrication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2010 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0163-1918
  • Print_ISBN
    978-1-4424-7418-5
  • Electronic_ISBN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.2010.5703467
  • Filename
    5703467