DocumentCode
2371681
Title
Test chip fabrication with extreme ultraviolet lithography for high-volume manufacturing
Author
Mori, I. ; Aoyama, H.
Author_Institution
Semicond. Leading Edge Technol., Inc. (Selete), Tsukuba, Japan
fYear
2010
fDate
6-8 Dec. 2010
Abstract
Since launching the project to get extreme ultraviolet lithography (EUVL) ready for production, we focused on two issues: test chip fabrication down to a half pitch (hp) of 28 nm to assess an applicability of EUVL to the fabrication of logic devices (BEOL test chip); and the manufacturability of EUVL, for which we used a special PL test site to assess the electrical yield. Furthermore, we examined the potential of EUVL for device fabrication at sizes beyond hp 24 nm.
Keywords
nanofabrication; semiconductor device manufacture; ultraviolet lithography; BEOL test chips; EUVL; back-end-of-line test chip; electrical yield; extreme ultraviolet lithography; high-volume manufacturing; logic devices; test chip fabrication;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2010 IEEE International
Conference_Location
San Francisco, CA
ISSN
0163-1918
Print_ISBN
978-1-4424-7418-5
Electronic_ISBN
0163-1918
Type
conf
DOI
10.1109/IEDM.2010.5703467
Filename
5703467
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