• DocumentCode
    2372649
  • Title

    Heated tubing: Prefabricated or field trace and insulate?

  • Author

    Baen, Peter R. ; Johnson, Rory R.

  • Author_Institution
    Thermon Ind., Inc., San Marcos, TX
  • fYear
    2008
  • fDate
    22-27 June 2008
  • Firstpage
    46
  • Lastpage
    53
  • Abstract
    Heated instrument tubing is common throughout industry and is most often used for winterization. It is also common for tubing to be maintained at high temperatures for viscous processes or to keep gas samples above dew point and prevent condensation. In many cases the tubing is field routed, electrical heat tracing is then installed, followed by the insulation and weather barrier. Alternatively, pre-insulated and heat traced ldquotube bundlesrdquo are designed to expedite installation, minimize total installed cost, and ensure predictable and reliable operation. This paper addresses the advantages and limitations of both approaches.
  • Keywords
    electric heating; maintenance engineering; pipes; thermal insulation; condensation; dew point; electrical heat tracing; field fabrication; gas samples; heat traced tube bundles; heated instrument tubing; insulation barrier; pre-insulated tube bundles; prefabricated tubing; viscous processes; weather barrier; winterization; Building materials; Costs; Dielectrics and electrical insulation; Electric resistance; Instruments; Manufacturing; Passivation; Resistance heating; Temperature; USA Councils; CEMS (Continuous Emissions Monitoring Systems); Electrical Heat Tracing (EHT); Tube Bundles; chemical passivation; electropolished; heated umbilical; power-limiting; sample transport bundle; self-regulating; trace heating; winterization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Pulp and Paper Industry Technical Conference, 2008. PPIC 2008. Conference Record of 2008 54th Annual
  • Conference_Location
    Seattle, WA
  • ISSN
    0190-2172
  • Print_ISBN
    978-1-4244-2524-2
  • Electronic_ISBN
    0190-2172
  • Type

    conf

  • DOI
    10.1109/PAPCON.2008.4585816
  • Filename
    4585816