Title :
Multicontact hybrid interconnection
Author :
Karnaushenko, D.D. ; Lee, I.I. ; Karnaushenko, D.D.
Author_Institution :
Inst. of Semicond. Phys., Siberian Branch of Russian Acad. of Sci., Novosibirsk
Abstract :
The method of mechanical and electrical interconnection of functionality devices placed on the surfaces of different solid state materials by elastic strained films is described. Main advantages of the new method, in compare with the classical indium bump technique is shown.
Keywords :
integrated circuit interconnections; micromechanical devices; nanocontacts; nanoelectronics; MEMS; elastic strained films; electrical interconnection; indium bump technique; mechanical interconnection; multicontact hybrid interconnection; solid state materials; Contacts; Cooling; Crystals; Detectors; Indium; Integrated circuit interconnections; Semiconductor materials; Substrates; Temperature; Thermal stresses; Contact; hybrid; micro cantilever; surface;
Conference_Titel :
Electron Devices and Materials, 2008. EDM 2008. 9th International Workshop and Tutorials on
Conference_Location :
Novosibirsk
Print_ISBN :
978-5-7782-0893-3
DOI :
10.1109/SIBEDM.2008.4585848
