Title :
Ultrasonic modification of Sn-Ag-Cu alloy microstructure
Author :
Belyakov, Sergey A.
Author_Institution :
Bauman Moscow State Tech. Univ., Moscow
Abstract :
Near-eutectic ternary system Sn-Ag-Cu is becoming an evident choice in transition to lead-free technology in the microelectronic industry in view of numerous advantages comparing to other lead-free alternative solders. The present article investigates the principles of Sn-Ag-Cu alloy crystallization and ultrasonic influence on the nucleating alloy in order to optimize its microstructure. It has been shown that size, shape and quantity of intermetallic phases Ag3Sn, Cu6Sn5 and a phase composition of the near-eutectic ternary system Sn-Ag-Cu is under ultrasonic frequency influence.
Keywords :
copper alloys; crystallisation; integrated circuit technology; materials preparation; silver alloys; soldering; tin alloys; ultrasonic applications; Sn-Ag-Cu; alloy crystallization; alloy microstructure; intermetallic phase; lead-free soldering; lead-free technology; microelectronic industry; near-eutectic ternary system; nucleating alloy; phase composition; solder joint formation; ultrasonic frequency influence; ultrasonic modification; Copper alloys; Crystallization; Environmentally friendly manufacturing techniques; Frequency; Intermetallic; Lead; Microstructure; Soldering; Temperature; Thermomechanical processes; Near-eutectic ternary Sn-Ag-Cu alloy; microstructure; ultrasonic vibration;
Conference_Titel :
Electron Devices and Materials, 2008. EDM 2008. 9th International Workshop and Tutorials on
Conference_Location :
Novosibirsk
Print_ISBN :
978-5-7782-0893-3
DOI :
10.1109/SIBEDM.2008.4585865
