• DocumentCode
    2374298
  • Title

    Design and analysis of a transcutaneous telemetry device for brain stimulator

  • Author

    Wang, Weiming ; Hao, Hongwei ; Ma, Bozhi ; Liu, Fangjun ; Hu, Chunhua ; Li, Luming

  • Author_Institution
    Sch. of Aerosp., Tsinghua Univ., Beijing, China
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    2153
  • Lastpage
    2156
  • Abstract
    This paper proposes a transcutaneous bidirectional telemetry solution using resonant electromagnetic coupling and pulse interval modulation for low power loss and high performance in neuro-stimulator. The resonant electromagnetic coupling model is established on the base of resonance electromagnetism theory, and relationships between coupling coefficient, displacement tolerance, resonance frequency and telemetry distance are studied experimentally. One air-core coil is used as a time-shared transmitter and receiver antenna for controller, and one ferrite-core coil is used as the counter part for implantable device, which decreases the volume of the implantable part. Experiments verified that the average power consumption was about 33 uW for implantable part in this device under the testing condition of over 10 cm telemetry distance between the implantable part in titanium container and controller. Simultaneously, telemetry device is with good displacement tolerance.
  • Keywords
    biomedical telemetry; electromagnetic coupling; neurophysiology; prosthetics; pulse modulation; air-core coil; bidirectional telemetry; brain stimulator; neurostimulator; pulse interval modulation; receiver antenna; resonant electromagnetic coupling; time shared transmitter; transcutaneous telemetry device; Animals; Deep Brain Stimulation; Disease Models, Animal; Electromagnetic Phenomena; Equipment Design; Humans; Macaca mulatta; Male; Parkinsonian Disorders; Telemetry; Titanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5332504
  • Filename
    5332504