DocumentCode :
2375607
Title :
Electromechanical coupling model of electronic equipment and its applications
Author :
Wang, C.S. ; Duan, B.Y.
Author_Institution :
Key Lab. of Electron. Equip. of the Minister of Educ., Xidian Univ., Xi´´an, China
fYear :
2010
fDate :
4-7 Aug. 2010
Firstpage :
997
Lastpage :
1003
Abstract :
The rapid development of electronic equipment makes the study on electromechanical coupling problem (EMCP) a new research area. The electromechanical coupling analysis is a multidisciplinary problem mainly involving the structure, electromagnetics and thermology. To begin with, the methods of calculating three fields are presented involved in EMCP, which is followed by the coupling relation. Then, the electromechanical coupling modeling is developed of the typical electronic equipment including the reflector antenna, planar slotted antenna, active phased array antenna, and high-density packaging system. Simultaneously, the engineering applications of the electromechanical coupling model are discussed with useful results to validate the coupling model proposed.
Keywords :
active antenna arrays; antenna theory; planar antennas; reflector antennas; slot antennas; active phased array antenna; electromagnetics; electromechanical coupling model; electronic equipment; high-density packaging system; planar slotted antenna; reflector antenna; thermology; Arrays; Couplings; Electronic equipment; Mathematical model; Reflector antennas; Slot antennas;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mechatronics and Automation (ICMA), 2010 International Conference on
Conference_Location :
Xi´an
ISSN :
2152-7431
Print_ISBN :
978-1-4244-5140-1
Electronic_ISBN :
2152-7431
Type :
conf
DOI :
10.1109/ICMA.2010.5589350
Filename :
5589350
Link To Document :
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