Title :
Design and Fabrication of a High Temperature (250 °C Baseplate), High Power Density Silicon Carbide (SiC) Multichip Power Module (MCPM) Inverter
Author :
Cilio, Edgar ; Hornberger, Jared ; McPherson, Brice ; Schupbach, Roberto ; Lostetter, Alexander
Author_Institution :
Arkansas Power Electron. Int. Inc., Fayetteville, AR
Abstract :
A proof-of-concept single-phase silicon carbide (SiC)-based 3 kW inverter multichip power module (MCPM) has been built and tested achieving significant volume reduction (~85% smaller) when compared with similar state-of-the-art Si-based single-phase inverter modules. The SiC-based MCPM was tested from room temperature up to baseplate temperature of 250 degC while delivering over 120 Vrms to the load
Keywords :
invertors; multichip modules; silicon compounds; 25 degC; 3 kW; SiC; inverter multichip power module; proof-of-concept single-phase silicon carbide; single-phase inverter modules; volume reduction; Fabrication; Inverters; Microcontrollers; Multichip modules; Oscillators; Power electronics; Silicon carbide; Silicon on insulator technology; Temperature; Testing;
Conference_Titel :
IEEE Industrial Electronics, IECON 2006 - 32nd Annual Conference on
Conference_Location :
Paris
Print_ISBN :
1-4244-0390-1
DOI :
10.1109/IECON.2006.347960
