Algorithms for coupled transient simulation of circuits and complicated 3-D packaging

Author

Silveira, L. Miguel ; Kamon, Mattan ; White, Jacob

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA

fYear

1994

fDate

1-4 May 1994

Firstpage

962

Lastpage

970

Abstract

In this paper techniques are described for coupled simulation of complicated 3-D interconnect and nonlinear transistor drivers and receivers. The approach is based on combining: multipole-accelerated method-of-moments techniques for extracting frequency-dependent inductances and resistances for the interconnect; a sectioning method for fitting the frequency-domain data with a rational function; a balanced-realization approach to reducing the order of the rational function in a guaranteed stable manner; and an implementation of fast recursive convolution to incorporate the rational function in SPICE3. Results are presented to demonstrate some of the frequency-dependent effects in a packaging analysis problem

Keywords

SPICE; circuit analysis computing; digital simulation; driver circuits; method of moments; packaging; transient analysis; 3D interconnect; 3D packaging; SPICE3; balanced-realization approach; coupled transient simulation; fast recursive convolution; frequency-dependent effects; frequency-dependent inductances; frequency-dependent resistances; frequency-domain data; multipole-accelerated moment method; nonlinear transistor drivers; nonlinear transistor receivers; packaging analysis problem; rational function; sectioning method; Circuit simulation; Computational modeling; Computer simulation; Conductors; Coupling circuits; Electronics packaging; Frequency; Integrated circuit interconnections; Transmission line matrix methods; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367512

Filename

367512