DocumentCode :
2375995
Title :
Building of silicon mechanical sensors by bulk micromachining and anodic bonding
Author :
Lpadatu, D. ; Jakobsen, Henrik
Author_Institution :
SensoNor asa, Horten, Norway
Volume :
1
fYear :
1998
fDate :
6-10 Oct 1998
Firstpage :
33
Abstract :
This paper deals with some industrial aspects of microsensor technology and the approach taken by SensoNor in building silicon mechanical sensors. The paper gives a review of the two major technological tools employed in the fabrication of silicon mechanical sensors, micromachining and anodic bonding. To demonstrate the strength of the proven technology, several examples of feasible, low cost, highly reliable sensors are presented
Keywords :
anodisation; elemental semiconductors; micromachining; microsensors; silicon; wafer bonding; Si; anodic bonding; bulk micromachining; fabrication; microsensor technology; silicon mechanical sensor; Bonding; Consumer electronics; Costs; Electrostatic actuators; Fabrication; Mechanical sensors; Micromachining; Micromechanical devices; Silicon; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 1998. CAS '98 Proceedings. 1998 International
Conference_Location :
Sinaia
Print_ISBN :
0-7803-4432-4
Type :
conf
DOI :
10.1109/SMICND.1998.732269
Filename :
732269
Link To Document :
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