DocumentCode
2376092
Title
A method for troubleshooting noise internal to an IC
Author
Smith, Douglas C.
Author_Institution
Auspex Systems, Santa Clara, CA, USA
fYear
1997
fDate
18-22 Aug 1997
Firstpage
223
Lastpage
225
Abstract
A method for measuring internal noise in an IC package and its external manifestations is presented. Typical measured data are shown. Use of this measurement method can significantly increase the probability that a new or modified design is reliable, able to be manufactured, and meets EMC requirements. In addition, EMC and design problems resulting from internal chip noise can be found and fixed faster and at less expense than possible using more conventional methods
Keywords
electric noise measurement; electromagnetic compatibility; electromagnetic interference; integrated circuits; EMC requirements; internal IC noise troubleshooting; internal chip noise; internal noise measurement; measurement method; probability; Bonding; Crosstalk; Electromagnetic compatibility; Integrated circuit noise; Logic; Packaging; Pins; Semiconductor device measurement; Voltage; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 1997. IEEE 1997 International Symposium on
Conference_Location
Austin, TX
Print_ISBN
0-7803-4140-6
Type
conf
DOI
10.1109/ISEMC.1997.667573
Filename
667573
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