Title :
A method for troubleshooting noise internal to an IC
Author :
Smith, Douglas C.
Author_Institution :
Auspex Systems, Santa Clara, CA, USA
Abstract :
A method for measuring internal noise in an IC package and its external manifestations is presented. Typical measured data are shown. Use of this measurement method can significantly increase the probability that a new or modified design is reliable, able to be manufactured, and meets EMC requirements. In addition, EMC and design problems resulting from internal chip noise can be found and fixed faster and at less expense than possible using more conventional methods
Keywords :
electric noise measurement; electromagnetic compatibility; electromagnetic interference; integrated circuits; EMC requirements; internal IC noise troubleshooting; internal chip noise; internal noise measurement; measurement method; probability; Bonding; Crosstalk; Electromagnetic compatibility; Integrated circuit noise; Logic; Packaging; Pins; Semiconductor device measurement; Voltage; Wire;
Conference_Titel :
Electromagnetic Compatibility, 1997. IEEE 1997 International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-4140-6
DOI :
10.1109/ISEMC.1997.667573
