DocumentCode :
2376406
Title :
Bilaterally Metal-loaded Tri-plate Transmission Line with Loss-reduced Holes as a Low-loss and Low-cost Printed Transmission Lines at Millimeter-wavelengths
Author :
Tamaru, Ryo-ji ; Kuroki, Futoshi
Author_Institution :
Kure Nat. Coll. of Technol., Hiroshima
fYear :
2008
fDate :
27-31 Oct. 2008
Firstpage :
1265
Lastpage :
1268
Abstract :
Since surfaces of dielectric substrates for printed boards are usually roughened to make tight copper-coating, it was found out that an effective conductivity of a surface of the copper foil, attaching on the dielectric substrate, more degraded than that of an opposite surface of the copper foil, facing an air region, beyond centimeter frequencies. The transmission loss therefore degrades due to the roughness of the copper foil surface. On the other side, it is confirmed that the current density on the under surface of the copper foil decreases by symmetrically-loading metal patterns on both sides of the dielectric substrate and by biasing an equi-voltage to both metal patterns, and thus the transmission loss is relatively unaffected by the roughness of the dielectric surfaces. Based on this consideration, a bi-laterally metal-loaded tri-plate transmission line was evaluated by using a cheap FR-4 substrate, being poor material for use as millimeter-wave lengths but being cost-effective.
Keywords :
current density; printed circuits; surface roughness; transmission lines; FR-4 substrate; bilaterally metal-loaded tri-plate transmission line; dielectric substrate; dielectric surfaces; loss-reduced holes; millimeter-wave lengths; millimeter-wavelengths; symmetrically-loading metal patterns; transmission loss; Conductivity; Copper; Degradation; Dielectric losses; Dielectric substrates; Joining processes; Propagation losses; Rough surfaces; Surface roughness; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2008. EuMC 2008. 38th European
Conference_Location :
Amsterdam
Print_ISBN :
978-2-87487-006-4
Type :
conf
DOI :
10.1109/EUMC.2008.4751692
Filename :
4751692
Link To Document :
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