A 3D electromagnetic simulator for microwave and RF circuit boards

Author

Zheng, Jim-X

Author_Institution

Zeland Software Inc., San Francisco, CA, USA

fYear

1994

fDate

1-4 May 1994

Firstpage

550

Lastpage

556

Abstract

A general purpose electromagnetic simulator 1E3D has been developed for the analysis and design of high frequency and high speed electronic circuit structures. For an arbitrarily shaped 3D metallic structure in a layered structure, the integral equation and method of moments based simulator solves the current distribution on the structure expanded into roof-top functions on a set of 3D triangular and rectangular cells. The simulator is interfaced with standard MS-Windows application programs for layout and schematic editing and post-processing

Keywords

circuit analysis computing; integral equations; method of moments; microwave circuits; 1E3D; 3D electromagnetic simulator; 3D metallic structure; MS-Windows application programs; RF circuit boards; analysis; current distribution; design; high frequency electronic circuit structures; high speed electronic circuit structures; integral equation; layered structure; layout editing; method of moments; microwave circuit boards; post-processing; rectangular cells; roof-top functions; schematic editing; triangular cells; Algorithm design and analysis; Analytical models; Circuit simulation; Coupling circuits; Current distribution; Electronics packaging; Integral equations; Microwave circuits; Printed circuits; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367539

Filename

367539