DocumentCode :
237647
Title :
Smart dynamic sampling for wafer at risk reduction in semiconductor manufacturing
Author :
Housseman, Sylvain ; Dauzere-Peres, Stephane ; Rodriguez-Verjan, Gloria ; Pinaton, Jacques
Author_Institution :
Centre Microelectron. de Provence, Ecole des Mines de St.- Etienne, Gardanne, France
fYear :
2014
fDate :
18-22 Aug. 2014
Firstpage :
780
Lastpage :
785
Abstract :
Semiconductor manufacturing is highly complex and expensive, hence the early detection of problems is necessary to minimize the number of scraps and improve the overall yield. This paper presents an industrial application of dynamic sampling based on an aggregated risk indicator at process tool level. The objective is to identify the lots that should be measured to minimize the overall risk level of the fabrication plant (fab). Results show significant improvements compared with the previous strategy: Sampling decisions are better adapted to the current production state and to the workload in the inspection area. Several parameters and algorithms are proposed and compared using industrial data.
Keywords :
inspection; machine tools; semiconductor industry; dynamic sampling; fab plant; fabrication plant; inspection; risk reduction; sampling decisions; semiconductor manufacturing; smart dynamic sampling; wafer; Current measurement; Greedy algorithms; Inspection; Manufacturing; Production; Risk management; Time measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Automation Science and Engineering (CASE), 2014 IEEE International Conference on
Conference_Location :
Taipei
Type :
conf
DOI :
10.1109/CoASE.2014.6899414
Filename :
6899414
Link To Document :
بازگشت