DocumentCode
2376526
Title
Thermal characterization of a tape carrier package
Author
Pope, D.E. ; Do, H.T.
Author_Institution
Intel Corp., Chandler, AZ, USA
fYear
1994
fDate
1-4 May 1994
Firstpage
532
Lastpage
538
Abstract
The unenhanced thermal performance of Tape carrier Package (TCP) packages on 8 layer boards with internal planes is 19 C/W. Simple PCB enhancements such as the addition of thermal vias, alone or with the use of low profile heatsinks, brings the thermal performance in line with requirements for mobile computing platforms which do not have forced convection cooling options available. With forced convection cooling, devices with a power dissipation requirement of up to 4.7 C/W can be packaged in TCP format
Keywords
cooling; heat sinks; printed circuit design; surface mount technology; thermal resistance; PCB enhancements; TCP format; forced convection cooling; low profile heatsinks; mobile computing platforms; power dissipation requirement; tape carrier package; thermal performance; thermal vias; Acoustic testing; Cooling; Heat sinks; Microassembly; Mobile computing; Packaging; Power dissipation; Semiconductor device measurement; Temperature measurement; Thermal force;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location
Washington, DC
Print_ISBN
0-7803-0914-6
Type
conf
DOI
10.1109/ECTC.1994.367542
Filename
367542
Link To Document