Title :
Thermal characterization of a tape carrier package
Author :
Pope, D.E. ; Do, H.T.
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
The unenhanced thermal performance of Tape carrier Package (TCP) packages on 8 layer boards with internal planes is 19 C/W. Simple PCB enhancements such as the addition of thermal vias, alone or with the use of low profile heatsinks, brings the thermal performance in line with requirements for mobile computing platforms which do not have forced convection cooling options available. With forced convection cooling, devices with a power dissipation requirement of up to 4.7 C/W can be packaged in TCP format
Keywords :
cooling; heat sinks; printed circuit design; surface mount technology; thermal resistance; PCB enhancements; TCP format; forced convection cooling; low profile heatsinks; mobile computing platforms; power dissipation requirement; tape carrier package; thermal performance; thermal vias; Acoustic testing; Cooling; Heat sinks; Microassembly; Mobile computing; Packaging; Power dissipation; Semiconductor device measurement; Temperature measurement; Thermal force;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367542
