High sensitivity dry film photoresist for laser direct imaging system

Author

Uematsu, Teruhiro

Author_Institution

Adv. Material Dev. Div., Tokyo Ohka Kogyo Co. Ltd., Kanagawa, Japan

fYear

2001

fDate

2001

Firstpage

1036

Lastpage

1039

Abstract

We here introduce the dry film photo resist (DFR) used in the UV laser direct image (LDI) photo exposure system. The LDI system has the following advantages: special resist film is not required. The circuit pattern design can be changed easily. It is possible to reduce the manufacturing cost due to mechanization of the exposure process. The quality and the yield obtained by this mechanization can be improved. However, because the laser moves at high speed when DFR is exposed, the amount of the exposure to polymerize must be less than that of the usual method. Therefore, the DFR must have high photosensitivity and this we have developed. This new DFR can be used in the usual process of manufacturing print circuit boards (PCB) as well as other products using DFR in their manufacture. This DFR has been put on the market as UL500. We also introduce the current situation of the printing industry, which is working on the introduction of the LDI system

Keywords

economics; laser materials processing; photoresists; polymerisation; printed circuit manufacture; sensitivity; ultraviolet lithography; UV laser direct image; circuit pattern design; dry film photo resist; manufacturing cost; photo exposure; plating resistance; print circuit boards; printing industry; quality; resist film; yield; Argon; Circuits; Copper; Costs; Energy resolution; Lamination; Light sources; Manufacturing processes; Optical materials; Resists;

fLanguage

English

Publisher

ieee

Conference_Titel

Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on

Conference_Location

Tokyo

Print_ISBN

0-7695-1266-6

Type

conf

DOI

10.1109/.2001.992516

Filename

992516