Title :
Lead free activities of JEITA
Abstract :
JEITA evaluated the lift off phenomenon and control technologies available and examined the Sn-Zn-Bi and Sn-Ag-Cu solder materials. Further attention is needed for the reflow profiles and combination of components
Keywords :
bismuth alloys; circuit reliability; process control; reflow soldering; silver alloys; tin alloys; zinc alloys; JEITA; Sn-Ag-Cu solder; Sn-Zn-Bi solder; SnAgCu; SnZnBi; control; lift off phenomenon; reflow; Commercialization; Connectors; Copper; Electronic components; Environmentally friendly manufacturing techniques; Land surface; Land surface temperature; Lead; Mass production; Surface cracks;
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
0-7695-1266-6
DOI :
10.1109/.2001.992519
