Title :
JIEP project for low-temperature lead-free solders and its report on questionnaire survey
Author :
Suga, Tadatomo ; Takeuchi, Makoto
Author_Institution :
Univ. of Tokyo, Japan
Abstract :
The Japan Institute for Electronic Packaging (JIEP) has been carrying out a research project investigating low-temperature lead-free solders. This report describes the background of the project and the results of a questionnaire to companies dealing with lead-free soldering. The questionnaire elicits present points of view of Japanese manufacturers on low-temperature lead-free solders
Keywords :
circuit reliability; low-temperature techniques; packaging; reflow soldering; JIEP; Japanese manufacturers; low temperature lead-free solders; packaging; questionnaire; reflow; reliability; Electronic equipment manufacture; Electronic waste; Electronics packaging; Environmentally friendly manufacturing techniques; Joining processes; Lead; Manufacturing industries; Manufacturing processes; Soldering; Temperature;
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
0-7695-1266-6
DOI :
10.1109/.2001.992520
