Sn-Zn eutectic alloy soldering in a low oxygen atmosphere

Author

Tadauchi, Masahiro ; Komatsu, Izuru ; Tateishi, Hiroshi ; Teshima, Kouichi

Author_Institution

Environ. Eng. & Anal. Center, Toshiba Corp., Yokohama, Japan

fYear

2001

fDate

2001

Firstpage

1055

Lastpage

1058

Abstract

Since lead-free soldering is strongly required, the application of various alloys has been attempted. Among such solders, tin-zinc alloy is one of the most promising materials, because the eutectic point of this binary system (199°C) is close to that of tin-lead binary system (183°C). However, the wetting property of tin-zinc alloy is said to be inferior to that of tin-lead alloy. We found that tin-zinc alloy shows good wettability in a low oxygen atmosphere and favorable mechanical properties. Moreover, this alloy can be applied to flow soldering in a low oxygen atmosphere

Keywords

printed circuit manufacture; reflow soldering; tin alloys; wetting; zinc alloys; 199 degC; PWBs; Sn-Zn; Sn-Zn eutectic alloy; eutectic point; flow soldering; lead-free soldering; low oxygen atmosphere; mechanical properties; wettability; wetting property; Atmosphere; Environmentally friendly manufacturing techniques; Fatigue; Lead; Mechanical factors; Oxygen; Shape memory alloys; Soldering; Surface waves; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on

Conference_Location

Tokyo

Print_ISBN

0-7695-1266-6

Type

conf

DOI

10.1109/.2001.992521

Filename

992521