Title :
Sn-Zn eutectic alloy soldering in a low oxygen atmosphere
Author :
Tadauchi, Masahiro ; Komatsu, Izuru ; Tateishi, Hiroshi ; Teshima, Kouichi
Author_Institution :
Environ. Eng. & Anal. Center, Toshiba Corp., Yokohama, Japan
Abstract :
Since lead-free soldering is strongly required, the application of various alloys has been attempted. Among such solders, tin-zinc alloy is one of the most promising materials, because the eutectic point of this binary system (199°C) is close to that of tin-lead binary system (183°C). However, the wetting property of tin-zinc alloy is said to be inferior to that of tin-lead alloy. We found that tin-zinc alloy shows good wettability in a low oxygen atmosphere and favorable mechanical properties. Moreover, this alloy can be applied to flow soldering in a low oxygen atmosphere
Keywords :
printed circuit manufacture; reflow soldering; tin alloys; wetting; zinc alloys; 199 degC; PWBs; Sn-Zn; Sn-Zn eutectic alloy; eutectic point; flow soldering; lead-free soldering; low oxygen atmosphere; mechanical properties; wettability; wetting property; Atmosphere; Environmentally friendly manufacturing techniques; Fatigue; Lead; Mechanical factors; Oxygen; Shape memory alloys; Soldering; Surface waves; Temperature;
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
0-7695-1266-6
DOI :
10.1109/.2001.992521
