DocumentCode
2376691
Title
CSP mounting reliability with Sn-Zn-Bi in JIEP project
Author
Yu, Qang ; Kiga, Tomoya ; Takeuchi, Makoto ; Toi, Keiko ; Katou, Yoshihisa
Author_Institution
Dept. of Mech. Eng., Yokohama Nat. Univ., Japan
fYear
2001
fDate
2001
Firstpage
1059
Lastpage
1063
Abstract
Describes an experiment on CSP joining reliability with Sn-Zn-Bi paste and Sn-Ag-Cu/Sn-Pb balls by heat-exposure and mechanical tests. Reflow was carried out at 210, 220 and 230°C in air. The height of the ball array has a key role in the reliability. Aging at 125°C did not show any serious degradation
Keywords
ageing; bismuth alloys; chip scale packaging; circuit reliability; mechanical testing; reflow soldering; tin alloys; zinc alloys; 125 degC; 210 to 220 degC; CSP; JIEP project; Sn-Ag-Cu; Sn-Pb; Sn-Zn-Bi; Sn-Zn-Bi solder; aging; ball array height; heat-exposure; mechanical tests; mounting reliability; printed circuit board; reflow soldering; Chip scale packaging; Environmentally friendly manufacturing techniques; Fatigue; Laboratories; Lead; Mechanical engineering; Production engineering; Reliability engineering; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on
Conference_Location
Tokyo
Print_ISBN
0-7695-1266-6
Type
conf
DOI
10.1109/.2001.992522
Filename
992522
Link To Document