DocumentCode
2376718
Title
Three dimensional finite element determination of current density and temperature distributions in pillar vias
Author
Trattles, J.T. ; O´Neill, A.G. ; Mecrow, B.C.
Author_Institution
Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
fYear
1991
fDate
11-12 Jun 1991
Firstpage
343
Lastpage
345
Abstract
Current crowding and local heating in multilevel interconnects have been studied by the self-consistent solution of the electrical and thermal conduction equations in three dimensions using the finite element method. The results demonstrate the need for three dimensional simulations to optimise process design rules and to fully understand design trade-offs
Keywords
current density; electromigration; finite element analysis; metallisation; temperature distribution; 3D finite element determination; current density; design trade-offs; electromigration induced failure; local heating; multilevel interconnects; pillar vias; process design rules; self-consistent solution; temperature distributions; thermal conduction equations; Current density; Electromigration; Equations; Finite element methods; Insulation life; Process design; Proximity effect; Resistance heating; Temperature distribution; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Multilevel Interconnection Conference, 1991, Proceedings., Eighth International IEEE
Conference_Location
Santa Clara, CA
Print_ISBN
0-87942-673-X
Type
conf
DOI
10.1109/VMIC.1991.153020
Filename
153020
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