DocumentCode
2376788
Title
High Performance Vertical Transition from DC to 70 GHz for System-on-Package Applications
Author
Ju, Inkwon ; Yom, In-Bok ; Lee, Ho-sin ; Oh, Seung-hyeup
Author_Institution
Global Area Wireless Technol. Group, ETRI, Daejeon
fYear
2008
fDate
27-31 Oct. 2008
Firstpage
1338
Lastpage
1341
Abstract
High performance vertical transition from DC to 70 GHz was proposed for system-on-package (SoP) applications. The trough line, slab line and shielded multilayer coplanar waveguides were employed to minimize the radiation loss, crosstalk and discontinuity of a conventional via vertical transition. The half square via pad was used in order to prevent unwanted coupling between the transmission lines of the vertical transition. The proposed vertical transition was made using a LTCC process. The manufactured single vertical transition showed a low insertion loss less than 0.7 dB and a reflection loss below -13 dB in the frequency range of DC to 70 GHz.
Keywords
coplanar waveguides; system-on-package; transmission lines; LTCC process; frequency 70 GHz; high-performance vertical transition; shielded multilayer coplanar waveguides; slab line; system-on-package applications; transmission lines; trough line; Coplanar transmission lines; Coplanar waveguides; Couplings; Crosstalk; Manufacturing; Nonhomogeneous media; Slabs; Transmission line discontinuities; Waveguide discontinuities; Waveguide transitions;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2008. EuMC 2008. 38th European
Conference_Location
Amsterdam
Print_ISBN
978-2-87487-006-4
Type
conf
DOI
10.1109/EUMC.2008.4751711
Filename
4751711
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