Thermal modelling of the Pentium processor package

Author

Rosten, Harvey I. ; Viswanath, Ram

Author_Institution

Flomerics Ltd., Kingston-Upon-Thames, UK

fYear

1994

fDate

1-4 May 1994

Firstpage

421

Lastpage

428

Abstract

Large mono-chip packages show a trend of increasing power dissipation and power density: for example the maximum dissipation of the Pentium processor is 16 Watts compared to the 6 Watts of its 80486 predecessor. This poses challenges for equipment designers to provide satisfactory thermal environments for reliable package operation. This paper provides an example of a component manufacturer and a thermal-analysis software vendor working together to construct and validate a thermal model of first-level packaging of a die (the Pentium processor) that can be used by equipment designers concerned with second- and third-level packaging. It is proposed that this example might set a pattern for the future

Keywords

cooling; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; microprocessor chips; reliability theory; 16 W; Pentium processor package; first-level packaging; mono-chip packages; power density; power dissipation; reliable package operation; second-level packaging; thermal environments; thermal model; third-level packaging; Manufacturing processes; Packaging machines; Software packages; Surface resistance; Temperature dependence; Temperature distribution; Thermal conductivity; Thermal resistance; Trademarks; Virtual manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367556

Filename

367556