Title :
Thermal modelling of the Pentium processor package
Author :
Rosten, Harvey I. ; Viswanath, Ram
Author_Institution :
Flomerics Ltd., Kingston-Upon-Thames, UK
Abstract :
Large mono-chip packages show a trend of increasing power dissipation and power density: for example the maximum dissipation of the Pentium processor is 16 Watts compared to the 6 Watts of its 80486 predecessor. This poses challenges for equipment designers to provide satisfactory thermal environments for reliable package operation. This paper provides an example of a component manufacturer and a thermal-analysis software vendor working together to construct and validate a thermal model of first-level packaging of a die (the Pentium processor) that can be used by equipment designers concerned with second- and third-level packaging. It is proposed that this example might set a pattern for the future
Keywords :
cooling; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; microprocessor chips; reliability theory; 16 W; Pentium processor package; first-level packaging; mono-chip packages; power density; power dissipation; reliable package operation; second-level packaging; thermal environments; thermal model; third-level packaging; Manufacturing processes; Packaging machines; Software packages; Surface resistance; Temperature dependence; Temperature distribution; Thermal conductivity; Thermal resistance; Trademarks; Virtual manufacturing;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367556
