Title :
Application of CFD Technology to electronic thermal management
Author :
Lee, Tom ; Chambers, Barry ; Mahalingam, Mali
Author_Institution :
Adv. Packaging Dev. Sector, Motorola Inc., Phoenix, AZ, USA
Abstract :
Application of a Computational Fluids Dynamics (CFD) tool to the thermal modeling of free convection cooled handheld/portable products and component level products is assessed. The results of two case studies are reviewed. The first case focuses on a sealed, system level enclosure typical of portable consumer products; while the second case looks at a component level analysis of a sealed multichip module (MCM) package possessing an internal cavity. Temperatures predicted by the simulations are compared to available experimental data as a means of assessing the software´s ability to adequately solve the coupled fluid dynamics/heat transfer problem. All simulation results were within 10% of experimental results for these two cases, indicating the software is readily capable of providing good thermal performance predictions
Keywords :
CAD; cooling; multichip modules; packaging; CFD Technology; component level products; computational fluid dynamics; consumer products; coupled fluid dynamics/heat transfer problem; electronic thermal management; free convection cooling; internal cavity; multichip module; portable products; system level enclosure; thermal performance predictions; Computational fluid dynamics; Consumer products; Fluid dynamics; Multichip modules; Packaging; Predictive models; Technology management; Temperature; Thermal management; Thermal management of electronics;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367557
