Application of CFD Technology to electronic thermal management

Author

Lee, Tom ; Chambers, Barry ; Mahalingam, Mali

Author_Institution

Adv. Packaging Dev. Sector, Motorola Inc., Phoenix, AZ, USA

fYear

1994

fDate

1-4 May 1994

Firstpage

411

Lastpage

420

Abstract

Application of a Computational Fluids Dynamics (CFD) tool to the thermal modeling of free convection cooled handheld/portable products and component level products is assessed. The results of two case studies are reviewed. The first case focuses on a sealed, system level enclosure typical of portable consumer products; while the second case looks at a component level analysis of a sealed multichip module (MCM) package possessing an internal cavity. Temperatures predicted by the simulations are compared to available experimental data as a means of assessing the software´s ability to adequately solve the coupled fluid dynamics/heat transfer problem. All simulation results were within 10% of experimental results for these two cases, indicating the software is readily capable of providing good thermal performance predictions

Keywords

CAD; cooling; multichip modules; packaging; CFD Technology; component level products; computational fluid dynamics; consumer products; coupled fluid dynamics/heat transfer problem; electronic thermal management; free convection cooling; internal cavity; multichip module; portable products; system level enclosure; thermal performance predictions; Computational fluid dynamics; Consumer products; Fluid dynamics; Multichip modules; Packaging; Predictive models; Technology management; Temperature; Thermal management; Thermal management of electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367557

Filename

367557