DocumentCode
2376968
Title
Fine line circuit manufacturing technology with electroless copper plating
Author
Akahoshi, Haruo ; Kawamoto, Mineo ; Itabashi, Takeyuki ; Miura, Osamu ; Takahashi, Akio ; Kobayashi, Shiro ; Miyazaki, Masashi ; Mutho, Tsunefumi ; Wajima, Motoyo ; Ishimaru, Toshiaki
Author_Institution
Res. Lab., Hitachi Ltd., Ibaraki, Japan
fYear
1994
fDate
1-4 May 1994
Firstpage
367
Lastpage
373
Abstract
Two types of additive processes for fine circuit pattern manufacturing technology using electroless copper plating have been developed. The processes offer high dimensional accuracy. Technical aspects of the additive processes, materials for the fabrication of additive circuits, and the performance of these circuits are reported here
Keywords
copper; delamination; electroless deposition; fine-pitch technology; metallisation; multichip modules; printed circuit manufacture; Cu; MCM; PCB; PWB; additive processes; electroless Cu plating; fabrication; fine circuit pattern manufacturing technology; high dimensional accuracy; packaging; Additives; Chemical technology; Circuits; Copper; Etching; Fabrication; Laminates; Manufacturing processes; Resists; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location
Washington, DC
Print_ISBN
0-7803-0914-6
Type
conf
DOI
10.1109/ECTC.1994.367562
Filename
367562
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