A Novel Electromagnetic Bandgap Structure for Broadband Switching Noise Suppression in High-Speed Printed Circuit Boards

Author

Genovesi, Simone ; Monorchio, Agostino

Author_Institution

Dept. of Inf. Eng., Univ. of Pisa, Pisa

fYear

2008

fDate

27-31 Oct. 2008

Firstpage

1374

Lastpage

1377

Abstract

The use of vias as interconnection structure in high-density system on package (SoP) substrates and printed circuit boards (PCBs) is the most common solution to route signals in multilayer structures. However this configuration poses a problem in term of simultaneous swithching noise (SSN) producing false switching in digital circuits and malfunctioning in analog circuits. The purpose of this work is to present a novel planar electromagnetic bandgap (EBG) structure which is able to overcome this drawback within a large bandwidth (1.0 GHz - 6.6 GHz) with a good suppression level (less than -30 dB) and also along a wide range of directions.

Keywords

circuit switching; interference suppression; photonic band gap; printed circuits; system-on-package; broadband switching; electromagnetic bandgap structure; frequency 1 GHz to 6.6 GHz; high-speed printed circuit boards; noise suppression; system on package substrates; Analog circuits; Circuit noise; Digital circuits; Electromagnetic interference; Integrated circuit interconnections; Nonhomogeneous media; Packaging; Periodic structures; Printed circuits; Switching circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2008. EuMC 2008. 38th European

Conference_Location

Amsterdam

Print_ISBN

978-2-87487-006-4

Type

conf

DOI

10.1109/EUMC.2008.4751720

Filename

4751720