DocumentCode
2377110
Title
An effective diagnosis method to support yield improvement
Author
Hora, Camelia ; Segers, Rene ; Eichenberger, Stefan ; Lousberg, Maurice
Author_Institution
Eindhoven Univ. of Technol., Netherlands
fYear
2002
fDate
2002
Firstpage
260
Lastpage
269
Abstract
The ability to achieve and maintain high yield levels depends on the capability of detecting, analyzing and correcting repetitive failure mechanisms. In this paper, a statistical fault diagnosis method based on using only the first or the first few failing test vectors is presented. The new approach is analyzing the failing vectors from an entire lot and produces a finite list of suspect locations, which are then subjected to further statistical and physical analysis. The results of the performed case studies show the usefulness of this method when applied in a production environment. We were able to detect repetitive failure mechanisms and accurately correlate electrical fail locations to in-line inspection data and thus greatly improve the accuracy of the determined kill ratio.
Keywords
failure analysis; fault location; inspection; integrated circuit reliability; integrated circuit testing; integrated circuit yield; production testing; statistical analysis; IC yield improvement; electrical fail locations; failing test vectors; finite suspect locations list; in-line inspection data correlation; kill ratio; physical analysis; production environment; repetitive failure mechanisms; semiconductor industry; statistical analysis; statistical fault diagnosis method; Electronics industry; Environmental economics; Failure analysis; Fault diagnosis; Inspection; Logic testing; Phase detection; Production; Semiconductor device manufacture; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2002. Proceedings. International
ISSN
1089-3539
Print_ISBN
0-7803-7542-4
Type
conf
DOI
10.1109/TEST.2002.1041768
Filename
1041768
Link To Document