DocumentCode :
2377110
Title :
An effective diagnosis method to support yield improvement
Author :
Hora, Camelia ; Segers, Rene ; Eichenberger, Stefan ; Lousberg, Maurice
Author_Institution :
Eindhoven Univ. of Technol., Netherlands
fYear :
2002
fDate :
2002
Firstpage :
260
Lastpage :
269
Abstract :
The ability to achieve and maintain high yield levels depends on the capability of detecting, analyzing and correcting repetitive failure mechanisms. In this paper, a statistical fault diagnosis method based on using only the first or the first few failing test vectors is presented. The new approach is analyzing the failing vectors from an entire lot and produces a finite list of suspect locations, which are then subjected to further statistical and physical analysis. The results of the performed case studies show the usefulness of this method when applied in a production environment. We were able to detect repetitive failure mechanisms and accurately correlate electrical fail locations to in-line inspection data and thus greatly improve the accuracy of the determined kill ratio.
Keywords :
failure analysis; fault location; inspection; integrated circuit reliability; integrated circuit testing; integrated circuit yield; production testing; statistical analysis; IC yield improvement; electrical fail locations; failing test vectors; finite suspect locations list; in-line inspection data correlation; kill ratio; physical analysis; production environment; repetitive failure mechanisms; semiconductor industry; statistical analysis; statistical fault diagnosis method; Electronics industry; Environmental economics; Failure analysis; Fault diagnosis; Inspection; Logic testing; Phase detection; Production; Semiconductor device manufacture; Topology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 2002. Proceedings. International
ISSN :
1089-3539
Print_ISBN :
0-7803-7542-4
Type :
conf
DOI :
10.1109/TEST.2002.1041768
Filename :
1041768
Link To Document :
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