• DocumentCode
    2377118
  • Title

    Across the great divide: examination of simulation data with actual silicon waveforms improves device characterization and production test development

  • Author

    Austin, Tom ; Canlas, Charisma ; Morgan, Brady ; Rodriguez, Jorge Luis

  • Author_Institution
    Teradyne Inc., USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    270
  • Lastpage
    279
  • Abstract
    Engineers face major challenges when they try to debug problems with a device being characterized or tested at a remote site. They find it difficult, time consuming, and error prone to gather waveform data from a separate facility for analysis. This paper discusses a tool for specifying data to be collected, automating its capture, and the means of displaying and comparing to waveforms previously collected through simulation of the device during the product design phase. Specific ways of viewing not only these different waveforms but also the relationships between them are presented. We also describe the development of such a system, its inclusion in the design flow for new IC development, and the resulting improvements in new product introduction from the viewpoint of design and test.
  • Keywords
    circuit simulation; data acquisition; electronic data interchange; integrated circuit design; integrated circuit modelling; integrated circuit testing; product development; production testing; IC development design flow; Si; actual silicon waveforms; data capture automation; data collection specification tool; device characterization; device debug; device production test development; product design; product design phase simulation; product introduction; product test; remote test site; simulation data; waveform comparison; waveform data; Analytical models; Data engineering; Design engineering; Displays; Integrated circuit modeling; Integrated circuit testing; Predictive models; Production; Silicon; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2002. Proceedings. International
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-7542-4
  • Type

    conf

  • DOI
    10.1109/TEST.2002.1041769
  • Filename
    1041769