• DocumentCode
    23772
  • Title

    Enabling Collaborative Solutions Across the Semiconductor Manufacturing Ecosystem

  • Author

    Jiting Yang ; Weber, Charles M. ; Gabella, Patricia

  • Author_Institution
    Dept. of Eng. & Technol. Manage., Portland State Univ., Portland, OR, USA
  • Volume
    26
  • Issue
    4
  • fYear
    2013
  • fDate
    Nov. 2013
  • Firstpage
    465
  • Lastpage
    475
  • Abstract
    A qualitative empirical study of 29 semiconductor manufacturer and supplier firms investigates the challenges associated with implementing lean practices that require broadly based collaboration across firms. The study´s primary contribution is a model of the semiconductor manufacturing ecosystem, which shows how chipmakers, suppliers of enabling technologies, subsystem suppliers, and their respective competitors interact to develop the right technologies at the right time. The study finds that the biggest challenge to industry-wide collaboration is managing knowledge flows between users and suppliers in a manner that allows all parties to collaborate without losing competitive advantage. The paper also presents insights into how inter-organizational knowledge is created synchronously in the semiconductor industry. Finally, the paper makes suggestions as to how interfirm knowledge can be managed.
  • Keywords
    knowledge management; lean production; organisational aspects; semiconductor device manufacture; chipmakers; interorganizational knowledge; knowledge management; lean practices; semiconductor industry; semiconductor manufacturing ecosystem; Collaboration; Ecosystems; Knowledge management; Manufacturing; Semiconductor device manufacture; Collaborate; ecosystem; lean semiconductor manufacturing;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2013.2258414
  • Filename
    6502738