DocumentCode
23772
Title
Enabling Collaborative Solutions Across the Semiconductor Manufacturing Ecosystem
Author
Jiting Yang ; Weber, Charles M. ; Gabella, Patricia
Author_Institution
Dept. of Eng. & Technol. Manage., Portland State Univ., Portland, OR, USA
Volume
26
Issue
4
fYear
2013
fDate
Nov. 2013
Firstpage
465
Lastpage
475
Abstract
A qualitative empirical study of 29 semiconductor manufacturer and supplier firms investigates the challenges associated with implementing lean practices that require broadly based collaboration across firms. The study´s primary contribution is a model of the semiconductor manufacturing ecosystem, which shows how chipmakers, suppliers of enabling technologies, subsystem suppliers, and their respective competitors interact to develop the right technologies at the right time. The study finds that the biggest challenge to industry-wide collaboration is managing knowledge flows between users and suppliers in a manner that allows all parties to collaborate without losing competitive advantage. The paper also presents insights into how inter-organizational knowledge is created synchronously in the semiconductor industry. Finally, the paper makes suggestions as to how interfirm knowledge can be managed.
Keywords
knowledge management; lean production; organisational aspects; semiconductor device manufacture; chipmakers; interorganizational knowledge; knowledge management; lean practices; semiconductor industry; semiconductor manufacturing ecosystem; Collaboration; Ecosystems; Knowledge management; Manufacturing; Semiconductor device manufacture; Collaborate; ecosystem; lean semiconductor manufacturing;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2013.2258414
Filename
6502738
Link To Document