Low cost design of a high performance MCM

A highly successful MultiChip Module (MCM) processor family, demonstrating advanced microelectronics packaging technologies, was developed for a wide range of applications. The technical success of the modules, however, was diminished by their high price. The cost problem was attributed to still immature technologies and support in the areas of: known-good-die, substrate manufacturing, minimal standardization, over-designing due to lack of qualification and test data and of course, the lack of high-volume orders. These high-cost modules have been the focus of an intensive cost reduction effort aimed at reducing the module cost by at least an order of magnitude over the next few years. The same design architecture has been studied for implementation in MCM-D, MCM-C, MCM-L, and possible combination approaches. Alternatives in known-good-die, next-level packaging, test, and assembly have been studied as well. Open dialogues with participating vendors has been emphasized to identify the “most producible” design specification that meets the size, performance, and cost goals