Title :
Entry level MCM/MCP trade-offs and considerations
Author :
Falgiano, V.J. ; Newberry, R.
Author_Institution :
Nat. Semicond. Corp., Santa Clara, CA, USA
Abstract :
The paper describes examples of entry level MCMs consisting of few chip modules and substrateless MCP (Multi Chip Packages) in standard IC package form factors. The examples define the types of modules in this class and describe the considerations of these types of circuits where quick time to market, low-cost, size, and high volume are the primary motivation for using an MCM
Keywords :
economics; multichip modules; packaging; entry level MCMs; multi chip packages; standard IC package form factors; substrateless MCP; Costs; Electronic design automation and methodology; Integrated circuit packaging; Laminates; Manufacturing processes; Plastic integrated circuit packaging; Plastic packaging; Semiconductor device packaging; Substrates; Time to market;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367579
