Title :
Transfer laminate circuit process for fine pitch wiring technology
Author :
Tsubomatsu, Yoshiaki ; Yoshidomi, Yasunobu ; Ohhata, Hirohito ; Yamazaki, Toshio ; Fukutomi, Naoki
Author_Institution :
Hitachi Chem. Co. Ltd., Ibaraki, Japan
Abstract :
The transfer laminate circuit (TLC) process is presented which has a vast potential for extending the wiring density of laminated multichip modules (MCM-Ls) to a level of deposited MCMs (MCM-Ds). In this paper, factors affecting the resolution of wiring patterns produced by TLC process are studied and a feasibility of making fine pitch wiring patterns is demonstrated
Keywords :
fine-pitch technology; laminates; microassembling; multichip modules; MCM-L; fine pitch wiring technology; laminated MCM; multichip modules; transfer laminate circuit process; wiring pattern resolution; Copper; Dielectric substrates; Dry etching; Fabrication; Geometry; Integrated circuit interconnections; Laminates; Pattern formation; Resists; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367581
