Liquid encapsulant and uniaxial calibration mechanical stress measurement with the ATC04 assembly test chip

Author

Sweet, James N. ; Peterson, David W. ; Emerson, John A.

Author_Institution

Sandia Nat. Labs., Albuquerque, NM, USA

fYear

1994

fDate

1-4 May 1994

Firstpage

750

Lastpage

757

Abstract

A new assembly test chip, ATC04, designed to measure mechanical stresses at the die surface has been built and tested. This CMOS chip, 0.25 in. on a side, has an array of 25 piezoresistive stress sensing cells, four resistive heaters and two ring oscillators. The ATC04 chip facilitates making stress measurements with relatively simple test equipment and data analysis. The design, use, and accuracy of the chip are discussed and initial results presented from three types of stress measurement experiments: four-point bending calibration, single point bending of a substrate with an ATC04 attached by epoxy, and stress produced by a liquid epoxy encapsulant

Keywords

CMOS integrated circuits; bending; calibration; data analysis; electric sensing devices; encapsulation; integrated circuit packaging; integrated circuit testing; microassembling; piezoelectric transducers; stress measurement; test equipment; 0.25 in; ATC04 assembly test chip; CMOS chip; die surface; four-point bending calibration; liquid encapsulant; liquid epoxy; mechanical stress measurement; piezoresistive stress sensing cells; resistive heaters; ring oscillators; sensor array; single point bending; uniaxial calibration; Assembly; Calibration; Data analysis; Mechanical variables measurement; Piezoresistance; Ring oscillators; Semiconductor device measurement; Stress measurement; Test equipment; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367586

Filename

367586