Connectivity-based multichip module repair

Author

Choi, M. ; Park, N. ; Meyer, F. ; Lombardi, F.

Author_Institution

Dept. of Comput. Sci., Oklahoma State Univ., Stillwater, OK, USA

fYear

2001

fDate

2001

Firstpage

19

Lastpage

26

Abstract

This paper presents a new model for analyzing the yield of MCM systems with repair process. It exploits the connectivity of the interconnected chips in which yield degradation due to both neighboring chips and interconnect structure are taken into account. Based on the connectivity, two MCM repair scheduling strategies, Smallest Number of Interconnections First (SNIF) and Smallest Number of Neighboring Chips First (SNCF) are proposed Two other scheduling strategies, Largest Number of Interconnections First (LNIF) and Largest Number of Neighboring Chips First (LNCF) are also introduced and analyzed to further explore the impact of connectivity-based repair scheduling on the overall yield of MCMs. Extensive parametric simulations demonstrate the efficiency of the proposed MCM repair scheduling strategies

Keywords

maintenance engineering; multichip modules; printed circuit manufacture; scheduling; MCM systems; Multichip Module; connectivity; connectivity-based repair scheduling; interconnected chips; repair process; repair scheduling strategies; yield; Assembly; Degradation; Delay systems; Fabrication; Integrated circuit interconnections; Multichip modules; Packaging; Scheduling; System performance; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Dependable Computing, 2001. Proceedings. 2001 Pacific Rim International Symposium on

Conference_Location

Seoul

Print_ISBN

0-7695-1414-6

Type

conf

DOI

10.1109/PRDC.2001.992675

Filename

992675