DocumentCode
2377511
Title
A new Y5V 0603 0.1 μF ceramic chip capacitor
Author
Day, John ; Gupta, Sri
Author_Institution
KEMET Electron. Corp., Greenville, SC, USA
fYear
1994
fDate
1-4 May 1994
Firstpage
716
Lastpage
720
Abstract
Improved technologies have been developed to manufacture 0.1 μF surface mountable ceramic chips in the 0603 size. A new dielectric based on barium titanate was developed with a Y5V temperature characteristic to achieve maximum dielectric constant. These parts achieve excellent electrical and mechanical reliability and are robust in wave soldering processes. To minimize cost the dielectric was designed to fire at 1145°C by adding compatible low melting glass frit in order to use low cost electrodes with a high percentage of silver. In order to increase the capacitance per layer improved manufacturing processes were developed to achieve thin dielectric layers and narrow electrode side margins
Keywords
barium compounds; ceramic capacitors; dielectric materials; electron device manufacture; permittivity; surface mount technology; wave soldering; 0.1 muF; 1145 C; BaTiO3; Y5V 0603 ceramic chip capacitor; barium titanate; capacitance; dielectric; dielectric constant; dielectric layers; electrical reliability; firing; low cost electrodes; low melting glass frit; manufacturing processes; mechanical reliability; silver; surface mountable ceramic chips; temperature characteristic; wave soldering; Barium; Capacitors; Ceramics; Costs; Dielectrics; Electrodes; Manufacturing; Surface-mount technology; Temperature; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location
Washington, DC
Print_ISBN
0-7803-0914-6
Type
conf
DOI
10.1109/ECTC.1994.367591
Filename
367591
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