Title :
A new Y5V 0603 0.1 μF ceramic chip capacitor
Author :
Day, John ; Gupta, Sri
Author_Institution :
KEMET Electron. Corp., Greenville, SC, USA
Abstract :
Improved technologies have been developed to manufacture 0.1 μF surface mountable ceramic chips in the 0603 size. A new dielectric based on barium titanate was developed with a Y5V temperature characteristic to achieve maximum dielectric constant. These parts achieve excellent electrical and mechanical reliability and are robust in wave soldering processes. To minimize cost the dielectric was designed to fire at 1145°C by adding compatible low melting glass frit in order to use low cost electrodes with a high percentage of silver. In order to increase the capacitance per layer improved manufacturing processes were developed to achieve thin dielectric layers and narrow electrode side margins
Keywords :
barium compounds; ceramic capacitors; dielectric materials; electron device manufacture; permittivity; surface mount technology; wave soldering; 0.1 muF; 1145 C; BaTiO3; Y5V 0603 ceramic chip capacitor; barium titanate; capacitance; dielectric; dielectric constant; dielectric layers; electrical reliability; firing; low cost electrodes; low melting glass frit; manufacturing processes; mechanical reliability; silver; surface mountable ceramic chips; temperature characteristic; wave soldering; Barium; Capacitors; Ceramics; Costs; Dielectrics; Electrodes; Manufacturing; Surface-mount technology; Temperature; Titanium compounds;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367591