• DocumentCode
    2377511
  • Title

    A new Y5V 0603 0.1 μF ceramic chip capacitor

  • Author

    Day, John ; Gupta, Sri

  • Author_Institution
    KEMET Electron. Corp., Greenville, SC, USA
  • fYear
    1994
  • fDate
    1-4 May 1994
  • Firstpage
    716
  • Lastpage
    720
  • Abstract
    Improved technologies have been developed to manufacture 0.1 μF surface mountable ceramic chips in the 0603 size. A new dielectric based on barium titanate was developed with a Y5V temperature characteristic to achieve maximum dielectric constant. These parts achieve excellent electrical and mechanical reliability and are robust in wave soldering processes. To minimize cost the dielectric was designed to fire at 1145°C by adding compatible low melting glass frit in order to use low cost electrodes with a high percentage of silver. In order to increase the capacitance per layer improved manufacturing processes were developed to achieve thin dielectric layers and narrow electrode side margins
  • Keywords
    barium compounds; ceramic capacitors; dielectric materials; electron device manufacture; permittivity; surface mount technology; wave soldering; 0.1 muF; 1145 C; BaTiO3; Y5V 0603 ceramic chip capacitor; barium titanate; capacitance; dielectric; dielectric constant; dielectric layers; electrical reliability; firing; low cost electrodes; low melting glass frit; manufacturing processes; mechanical reliability; silver; surface mountable ceramic chips; temperature characteristic; wave soldering; Barium; Capacitors; Ceramics; Costs; Dielectrics; Electrodes; Manufacturing; Surface-mount technology; Temperature; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1994. Proceedings., 44th
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-0914-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1994.367591
  • Filename
    367591