• DocumentCode
    2377622
  • Title

    A PC program that generates a model of the parasitics for IC packages

  • Author

    Caggiano, Michael F. ; De Angelis, Cara A.

  • Author_Institution
    Bell Lab., Allentown, PA, USA
  • fYear
    1994
  • fDate
    1-4 May 1994
  • Firstpage
    683
  • Lastpage
    686
  • Abstract
    The Package Parasitic Model Program is a PC program, that can generate a model of package parasitics for either dual-in-line or for quad flat pack IC packages. The user enters simple dimensional information for the geometries of the package from the package drawings. This information is easy to obtain and some of the more common dimensions can be defaulted if their values are unknown. The program, written in C, then constructs the proposed package layout and calculates each lead´s self inductance; its mutual inductance, mutual capacitance and the capacitance to a ground plane if one exists. The whole process of data entry and computer simulation usually takes just a few minutes on a 386 based PC. Results of benchmark package simulations agree to within 10% of hand calculations employing the reference´s equations and drawings of the package. The Package Parasitic Model Program is helpful in integrated circuit package design and analysis. It saves the time of tedious data entry required in the more sophisticated three dimensional programs that use large amounts of CPU time on work stations
  • Keywords
    capacitance; circuit layout CAD; digital simulation; inductance; integrated circuit design; integrated circuit packaging; IC packages; benchmark package simulations; computer simulation; dual-in-line; ground plane; lead self inductance; mutual capacitance; mutual inductance; package design; package layout; package parasitic model program; parasitics; quad flat pack; Capacitance; Circuit simulation; Computational modeling; Computer simulation; Electronics packaging; Equations; Inductance; Information geometry; Integrated circuit modeling; Integrated circuit packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1994. Proceedings., 44th
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-0914-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1994.367597
  • Filename
    367597