DocumentCode :
2377622
Title :
A PC program that generates a model of the parasitics for IC packages
Author :
Caggiano, Michael F. ; De Angelis, Cara A.
Author_Institution :
Bell Lab., Allentown, PA, USA
fYear :
1994
fDate :
1-4 May 1994
Firstpage :
683
Lastpage :
686
Abstract :
The Package Parasitic Model Program is a PC program, that can generate a model of package parasitics for either dual-in-line or for quad flat pack IC packages. The user enters simple dimensional information for the geometries of the package from the package drawings. This information is easy to obtain and some of the more common dimensions can be defaulted if their values are unknown. The program, written in C, then constructs the proposed package layout and calculates each lead´s self inductance; its mutual inductance, mutual capacitance and the capacitance to a ground plane if one exists. The whole process of data entry and computer simulation usually takes just a few minutes on a 386 based PC. Results of benchmark package simulations agree to within 10% of hand calculations employing the reference´s equations and drawings of the package. The Package Parasitic Model Program is helpful in integrated circuit package design and analysis. It saves the time of tedious data entry required in the more sophisticated three dimensional programs that use large amounts of CPU time on work stations
Keywords :
capacitance; circuit layout CAD; digital simulation; inductance; integrated circuit design; integrated circuit packaging; IC packages; benchmark package simulations; computer simulation; dual-in-line; ground plane; lead self inductance; mutual capacitance; mutual inductance; package design; package layout; package parasitic model program; parasitics; quad flat pack; Capacitance; Circuit simulation; Computational modeling; Computer simulation; Electronics packaging; Equations; Inductance; Information geometry; Integrated circuit modeling; Integrated circuit packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
Type :
conf
DOI :
10.1109/ECTC.1994.367597
Filename :
367597
Link To Document :
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