DocumentCode
2377788
Title
Design of 77 GHz Interconnects for Buried SiGe MMICs Using Novel System-in-Package Technology
Author
Richter, Marius D. ; Becker, Karl-F ; Böttcher, Lars ; Schneider, Martin
Author_Institution
Dept. of RF&Microwave Eng., Univ. of Bremen, Bremen
fYear
2008
fDate
27-31 Oct. 2008
Firstpage
1573
Lastpage
1576
Abstract
This paper describes the design, simulation and measurement of interconnects of buried active 77 GHz chips to a high frequency substrate using microvia technology. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.
Keywords
Ge-Si alloys; MMIC; integrated circuit interconnections; semiconductor materials; MMICs; buried active chips; frequency 77 GHz; high frequency substrate; interconnects; microvia technology; system-in-package technology; Drilling; Germanium silicon alloys; Integrated circuit interconnections; MMICs; Microstrip; RF signals; Radio frequency; Semiconductor device measurement; Silicon germanium; Voltage-controlled oscillators;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2008. EuMC 2008. 38th European
Conference_Location
Amsterdam
Print_ISBN
978-2-87487-006-4
Type
conf
DOI
10.1109/EUMC.2008.4751770
Filename
4751770
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