Laser created high density interconnects for quick prototyping of electronic circuits

The laser restructuring of electronic circuits, fabricated using standard Very Large Scale Integration (VLSI) process techniques, is an excellent alternative to custom chip development. This laser process allows for low cost, quick turnaround production with full circuit similarity between the Laser Restructured prototype and the customized product for mass production. The same techniques are also compatible with thin multichip modules (MCM-D). Laser Restructurable VLSI (LRVLSI) would allow design engineers the capability to interconnect cells that implement generic logic functions and signal processing schemes to achieve a higher level of design complexity. LRVLSI of a particular circuit at the wafer or packaged chip level is accomplished using an integrated computer controlled laser system to create low electrical resistance links between conductors and to cut conductor lines. An infrastructure for rapid prototyping and quick turnaround using Laser Restructuring of VLSI circuits was developed