Title :
Simple electrical model and initial experiments for intra-body communications
Author :
Gao, Y.M. ; Pun, S.-H. ; Du, M. ; Mak, P.U. ; Vai, M.-I.
Author_Institution :
Key Lab. of Med. Instrum. & Pharm. Technol., China
Abstract :
Intra-body Communication(IBC) is a short range ldquowirelessrdquo communication technique appeared in recent years. This technique relies on the conductive property of human tissue to transmit the electric signal among human body. This is beneficial for devices networking and sensors among human body, and especially suitable for wearable sensors, telemedicine system and home health care system as in general the data rates of physiologic parameters are low. In this article, galvanic coupling type IBC application on human limb was investigated in both its mathematical model and related experiments. The experimental results showed that the proposed mathematical model was capable in describing the galvanic coupling type IBC under low frequency. Additionally, the calculated result and experimental result also indicated that the electric signal induced by the transmitters of IBC can penetrate deep into human muscle and thus, provide an evident that IBC is capable of acting as networking technique for implantable devices.
Keywords :
bioelectric phenomena; health care; muscle; physiological models; radiocommunication; telemedicine; electric signal transmission; electrical model; galvanic coupling; home health care system; human muscle; human tissue conductive property; implantable devices; intra-body communication; physiologic parameters; telemedicine system; wearable sensors; wireless communication technique; Intra-Body Communication; electrical model; experiments; galvanic coupling type; Bone and Bones; Computer Simulation; Electric Wiring; Equipment Design; Equipment Failure Analysis; Humans; Models, Biological; Monitoring, Ambulatory; Pilot Projects; Prostheses and Implants; Telemetry;
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2009.5332704