UV curable urethane encapsulant for ceramic chip carriers

Author

Wilson, James W.

Author_Institution

IBM Corp., Endicott, NY, USA

fYear

1994

fDate

1-4 May 1994

Firstpage

152

Lastpage

158

Abstract

A new acrylated urethane encapsulant has been formulated for use on ceramic chip carriers. This encapsulant has been implemented on pin grid array (PGA) ceramic carriers and on peripheral leaded surface mount (SMT) ceramic carriers for IBM´s C4 chips. The encapsulant is a UV curable material and is used to cover the thin film circuitry on the ceramic carrier. The encapsulant offers a low cost alternative to the metal caps that were used on the pin grid array ceramic carriers or to the ceramic cap that was used on the peripheral leaded surface mount carrier. UV curing was chosen as the preferred curing process in order to improve the manufacturing process flow

Keywords

encapsulation; integrated circuit packaging; organic compounds; surface mount technology; thermal stresses; IBM C4 chips; PGA mounting; UV curable material; acrylated urethane encapsulant; ceramic chip carriers; peripheral leaded SMT carrier; pin grid array; surface mount carrier; thin film circuitry; Bonding; Ceramics; Circuits; Costs; Curing; Electronics packaging; Ovens; Packaging machines; Protection; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367637

Filename

367637