Title :
UV curable urethane encapsulant for ceramic chip carriers
Author :
Wilson, James W.
Author_Institution :
IBM Corp., Endicott, NY, USA
Abstract :
A new acrylated urethane encapsulant has been formulated for use on ceramic chip carriers. This encapsulant has been implemented on pin grid array (PGA) ceramic carriers and on peripheral leaded surface mount (SMT) ceramic carriers for IBM´s C4 chips. The encapsulant is a UV curable material and is used to cover the thin film circuitry on the ceramic carrier. The encapsulant offers a low cost alternative to the metal caps that were used on the pin grid array ceramic carriers or to the ceramic cap that was used on the peripheral leaded surface mount carrier. UV curing was chosen as the preferred curing process in order to improve the manufacturing process flow
Keywords :
encapsulation; integrated circuit packaging; organic compounds; surface mount technology; thermal stresses; IBM C4 chips; PGA mounting; UV curable material; acrylated urethane encapsulant; ceramic chip carriers; peripheral leaded SMT carrier; pin grid array; surface mount carrier; thin film circuitry; Bonding; Ceramics; Circuits; Costs; Curing; Electronics packaging; Ovens; Packaging machines; Protection; Surface-mount technology;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367637
