Title :
Development of a high performance TQFP package
Author :
Hoffman, P. ; Liang, D. ; Mahulikar, D. ; Parthasarathi, A.
Author_Institution :
Interconnect Technol., Olin Corp., New Haven, CT, USA
Abstract :
A TQFP (Thin Quad Flat Pack) package has been developed that has very superior electrical and thermal performance when compared to a plastic molded TQFP package. The high performance TQFP is based on Olin´s MQUAD technology; a packaging scheme where the plastic mold compound is replaced by an anodized aluminum base and lid adhesively sealed to the leadframe. The package uses the same IR or VPR board mounting profile as a plastic package, weighs the same as a plastic package, and is dimensionally equivalent to a plastic package
Keywords :
integrated circuit packaging; integrated circuit reliability; lead bonding; surface mount technology; MQUAD technology; TQFP package; adhesive seal; anodized aluminum base; board mounting profile; electrical performance; leadframe; thermal performance; thin quad flat pack; wire bonding; Aluminum; Application software; Atherosclerosis; Councils; Electron devices; Electronics packaging; Plastic packaging; Production; Seals; Semiconductor device packaging;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367651
