Title :
Design of 0.35-mm-pitch QFP lead and its assembly technology
Author :
Totani, Makoto ; Teshima, Yasuhiro ; Ito, Nobutaka ; Nagatake, Mami ; Otaguro, Hiroyuki
Author_Institution :
Fujitsu Labs. Ltd., Kawasaki, Japan
Abstract :
The solder joint reliability of a 0.35-mm-lead-pitch, 42 mm wide ×42 mm long ×23 mm high, 396 pin, ceramic quad flat package (QFP) was studied in terms of: A. Finite element analysis simulation using NISA II, B. Temperature cycling test between -65°C and +125°C. Using the study results, physical design of the QFP leads, in terms of thickness, stand-off, and Au surface finish were optimized. Also, we developed a thermocompression (T/C) soldering process for the QFP
Keywords :
environmental testing; finite element analysis; integrated circuit packaging; integrated circuit reliability; lead bonding; life testing; soldering; -65 to 125 degC; 0.35 mm; Au surface finish; NISA II; QFP lead; assembly technology; ceramic quad flat package; finite element analysis; solder joint reliability; stand-off; temperature cycling test; thermocompression soldering process; Analytical models; Assembly; Ceramics; Electronics packaging; Finite element methods; Gold; Lead; Soldering; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367653
