Title :
Low-cost ceramic thin-film ball grid arrays
Author :
Panicker, M.P.R. ; Greenman, N.L. ; Forster, James ; Johnston, Pat
Author_Institution :
Micro Substrates Corp., Tempe, AZ, USA
Abstract :
Ball grid array (BGA) is emerging as the next significant surface-mount package. This paper describes a simply structured, cost-effective ceramic BGA substrate, which conforms to current JEDEC registrations for flip-chip connections, as an alternative to multilayer co-fired ceramic BGA´s. The BGA, processed on VIA/PLANE, a ceramic wafer with hermetic, tungsten-copper vias, uses a thin-film deposition technique, Enhanced Ion Plating (EIP). Controlled-Collapse Chip Connection (C4), solder-bumped flip chips are typically full or partial arrays of 5 mil solder bumps on 10 mil centers. This BGA transforms the C4 density to 35 mil bumps on 50 mil centers, much more compatible with current surface-mount assembly practices. The use of VIA/PLANE maintains the time-proven reliability of C4 on ceramic, and the flatness characteristics of VIA/PLANE eminently complement C4 and BGA technologies
Keywords :
ceramics; flip-chip devices; ion plating; packaging; surface mount technology; C4 density; Controlled-Collapse Chip Connection; Enhanced Ion Plating; JEDEC registrations; VIA/PLANE; W-Cu; ball grid arrays; ceramic BGA substrate; flatness characteristics; flip-chip connections; hermetic tungsten-copper vias; low-cost technology; solder bumps; surface-mount package; thin-film deposition; Adhesives; Ceramics; Conductivity; Copper; Electronics packaging; Materials testing; Radio frequency; Sputtering; Substrates; Transistors;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367656
