A hi-density C4/CBGA interconnect technology for a CMOS microprocessor

Author

Kromann, Gary ; Gerke, David ; Huang, Wayne

Author_Institution

Adv. Packaging & Assembly Manuf., Motorola Inc., Austin, TX, USA

fYear

1994

fDate

1-4 May 1994

Firstpage

22

Lastpage

28

Abstract

The application of a controlled-collapse-chip-connection, ceramic-ball-grid-array (C4/CBGA) module for a RISC microprocessor is presented. The zero to second-level interconnection technologies and the various design considerations, from the on-chip redistribution metal to the single-chip module printed-circuit-board connection, are analysed. In addition to an overview of the interconnect technology, we discuss the: 1) electrical modeling and characterization, 2) board design and routability, 3) thermal management, and 4) C4 and ball-grid-array interconnection reliability

Keywords

CMOS digital integrated circuits; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; lead bonding; microprocessor chips; reflow soldering; surface mount technology; C4/CBGA interconnect technology; CMOS microprocessor; RISC microprocessor; board design; ceramic-ball-grid-array; controlled-collapse-chip-connection; electrical modeling; interconnection reliability; interconnection technologies; on-chip redistribution metal; printed-circuit-board connection; routability; thermal management; Aluminum; Assembly; CMOS technology; Lead; Microprocessors; Packaging; Reduced instruction set computing; Space technology; Surface-mount technology; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367657

Filename

367657