Controlled collapse chip connection (C4)-an enabling technology

Author

DeHaven, Keith ; Dietz, Joel

Author_Institution

Semicond. Prod. Sector, Motorola Inc., Austin, TX, USA

fYear

1994

fDate

1-4 May 1994

Firstpage

1

Lastpage

6

Abstract

Much of the technical information presented herein has been published by either IBM or Motorola This paper provides a higher-level view of the benefits, considerations and leverage applications of the C4 and DCA technologies. A key to acceptance and use of a new or different technology is its application in successful products. Although C4 is not new and has-been utilized extensively by IBM, it is different to Motorola. DCA is a relatively new technology and, thus, has a shorter history. As a foundation, this paper discusses the key C4 and DCA technical features and describes some initial product applications at Motorola. This linkage shows the enabling characteristics of the C4 flip-chip technology. Finally, future trends and directions of C4 and DCA technologies are discussed

Keywords

flip-chip devices; integrated circuit interconnections; integrated circuit packaging; reflow soldering; C4 technology; DCA technology; Motorola; controlled collapse chip connection; direct chip attach; flip-chip technology; product applications; Bonding; Ceramics; Electronics packaging; Integrated circuit interconnections; Manufacturing industries; Microprocessors; Printed circuits; Semiconductor device packaging; Semiconductor device reliability; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367660

Filename

367660