Title :
1994 Proceedings. 44th Electronic Components and Technology Conference
Abstract :
The following topics were dealt with: flip-chip/BGA packaging; enhanced packaging; modelling and simulation; encapsulants and moulding compounds; reliability of plastic packages; devices, technologies and applications; process advances; systems and modules; optoelectronic devices; metallisation and PCB processes; thermal simulation and electronic package characterisation; interconnection reliability assessment; leadframe packaging advances; PCBs for HF applications; die attach, adhesive and solder materials; ceramics and thick films; optoelectronic materials; multichip modules; electronic connector technology; gold-based interconnection systems; optical fibres and connectors; reliability test methods; hand soldering
Keywords :
electric connectors; encapsulation; flip-chip devices; metallisation; modelling; modules; optical couplers; optoelectronic devices; packaging; printed circuits; reliability; simulation; soldering; testing; BGA packaging; MCM; PCB processes; adhesive materials; ceramics; die attach materials; electronic connector technology; electronic package characterisation; encapsulants; flip-chip; leadframe packaging; metallisation; modelling; moulding compounds; multichip modules; optical connectors; optical fibres; optoelectronic devices; optoelectronic materials; plastic packages; reliability test methods; simulation; solder materials; soldering; thermal simulation; thick films;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367661
