Flip-chip hermetic packaging of RF MEMS

Author

Wilkerson, Patrick ; Kranz, Michael ; Przekwas, Andrzej ; Hudson, Tracy

Author_Institution

CFDRC, Huntsville, AL, USA

fYear

2001

fDate

2001

Firstpage

91

Lastpage

94

Abstract

RF MEMS (radio frequency micro electro mechanical systems) technology holds great promise for wireless communication and sensor systems. Excellent MEMS switching devices have recently been developed, but because of packaging problems, no commercial integrated product exists. The objective of the ongoing work at CFD Research Corporation (CFDRC) and Morgan Research Corporation (MORGAN) is to develop novel packaging concepts, design tools, and demonstrated RF MEMS packaged devices for high frequency applications

Keywords

electronic design automation; flip-chip devices; microassembling; micromechanical devices; microwave switches; semiconductor device packaging; semiconductor device testing; semiconductor switches; MEMS switching devices; RF MEMS; RF MEMS packaged devices; commercial integrated product; flip-chip hermetic packaging; high frequency applications; packaging; packaging design tools; radio frequency micro electro mechanical systems technology; sensor systems; wireless communication systems; Communication switching; Computational fluid dynamics; Micromechanical devices; Packaging; Performance analysis; Radio frequency; Radiofrequency microelectromechanical systems; Sensor systems; Switches; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectromechanical Systems Conference, 2001

Conference_Location

Berkeley, CA

Print_ISBN

0-7803-7224-7

Type

conf

DOI

10.1109/MEMSC.2001.992750

Filename

992750