Title :
Flip-chip hermetic packaging of RF MEMS
Author :
Wilkerson, Patrick ; Kranz, Michael ; Przekwas, Andrzej ; Hudson, Tracy
Author_Institution :
CFDRC, Huntsville, AL, USA
Abstract :
RF MEMS (radio frequency micro electro mechanical systems) technology holds great promise for wireless communication and sensor systems. Excellent MEMS switching devices have recently been developed, but because of packaging problems, no commercial integrated product exists. The objective of the ongoing work at CFD Research Corporation (CFDRC) and Morgan Research Corporation (MORGAN) is to develop novel packaging concepts, design tools, and demonstrated RF MEMS packaged devices for high frequency applications
Keywords :
electronic design automation; flip-chip devices; microassembling; micromechanical devices; microwave switches; semiconductor device packaging; semiconductor device testing; semiconductor switches; MEMS switching devices; RF MEMS; RF MEMS packaged devices; commercial integrated product; flip-chip hermetic packaging; high frequency applications; packaging; packaging design tools; radio frequency micro electro mechanical systems technology; sensor systems; wireless communication systems; Communication switching; Computational fluid dynamics; Micromechanical devices; Packaging; Performance analysis; Radio frequency; Radiofrequency microelectromechanical systems; Sensor systems; Switches; Wireless communication;
Conference_Titel :
Microelectromechanical Systems Conference, 2001
Conference_Location :
Berkeley, CA
Print_ISBN :
0-7803-7224-7
DOI :
10.1109/MEMSC.2001.992750
