DocumentCode
2379026
Title
A study of reliability issues in clock distribution networks
Author
Todri, A. ; Marek-Sadowska, M.
Author_Institution
ECE Dept., UCSB, Santa Barbara, CA
fYear
2008
fDate
12-15 Oct. 2008
Firstpage
101
Lastpage
106
Abstract
In this paper, we present a reliability study of clock mesh distribution networks. We analyze the electromigration (EM) phenomena and demonstrate their occurrence in clock mesh networks (CMN). Due to shrinking feature sizes in more advanced technologies, EM is becoming a more prominent reliability issue. Process variation, power supply noise, and clock gating are some of the factors that can increase electromigration in the clock mesh. We identity the potential EM branches by investigating current flows under various conditions. Our study shows that a clock mesh optimized for certain configurations of clock sinks may experience electromigration due to asymmetrical bidirectional currents flowing in some grid segments.
Keywords
clocks; electromigration; reliability; assymetrical bidirectional currents; clock gating; clock mesh distribution networks; electromigration phenomena; grid segments; power supply noise; process variation; Clocks; Conductivity; Current density; Electromigration; Heating; Mesh networks; Microprocessors; Power supplies; Stress; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design, 2008. ICCD 2008. IEEE International Conference on
Conference_Location
Lake Tahoe, CA
ISSN
1063-6404
Print_ISBN
978-1-4244-2657-7
Type
conf
DOI
10.1109/ICCD.2008.4751847
Filename
4751847
Link To Document