DocumentCode :
2379038
Title :
Integration of III-V on Si for High-Mobility CMOS
Author :
Waldron, Niamh ; Wang, Gang ; Nguyen, Ngoc Duy ; Orzali, Tommaso ; Merckling, Clement ; Brammertz, Guy ; Ong, Patrick ; Winderickx, Gillis ; Hellings, Geert ; Eneman, Geert ; Caymax, Matty ; Meuris, Marc ; Horiguchi, Naoto ; Thean, Aaron
Author_Institution :
imec, Leuven, Belgium
fYear :
2012
fDate :
4-6 June 2012
Firstpage :
1
Lastpage :
2
Abstract :
In this paper we present results from an InGaAs/InP implant free quantum well device integrated fully in a Si CMOS processing line. The virtual InP substrates are generated using a Si template which is prepared by standard STI processing. The Si in the STI trenches is etched and a Ge seed layer grown.
Keywords :
CMOS integrated circuits; III-V semiconductors; electron mobility; elemental semiconductors; etching; gallium arsenide; indium compounds; integration; ion implantation; quantum well devices; semiconductor growth; silicon; III-V semiconductors; InGaAs-InP; Si; etching; free quantum well device; high-mobility CMOS; implant; integration; seed layer grown; CMOS integrated circuits; Indium gallium arsenide; Indium phosphide; Logic gates; Silicon; Substrates; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Silicon-Germanium Technology and Device Meeting (ISTDM), 2012 International
Conference_Location :
Berkeley, CA
Print_ISBN :
978-1-4577-1864-9
Electronic_ISBN :
978-1-4577-1863-2
Type :
conf
DOI :
10.1109/ISTDM.2012.6222422
Filename :
6222422
Link To Document :
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