Title :
Scan and BIST can almost achieve test quality levels
Author_Institution :
Motorola Inc., Austin, TX, USA
Abstract :
Structural testing with both scan test and built-in self-test (BIST) has proven to be effective for detecting both gross static and at-speed defects. As tools and techniques improve, structural testing is approaching the high level of test quality necessary to eliminate test escapes. However, scan and BIST do not accomplish all that is needed. Parametric and functional tests are still needed for advanced microprocessor and systems on chip (SoC) designs.
Keywords :
automatic testing; boundary scan testing; built-in self test; logic testing; microprocessor chips; quality control; system-on-chip; BIST; at-speed defects; functional tests; gross static defects; microprocessor; parametric tests; scan test; structural testing; systems on chip; test quality; test quality levels; Automatic test pattern generation; Automatic testing; Built-in self-test; Circuit testing; Design for testability; Failure analysis; Microprocessors; Probes; System testing; System-on-a-chip;
Conference_Titel :
Test Conference, 2002. Proceedings. International
Print_ISBN :
0-7803-7542-4
DOI :
10.1109/TEST.2002.1041903
