• DocumentCode
    2379087
  • Title

    Scan-based testing: the only practical solution for testing ASIC/consumer products

  • Author

    Nigh, Phil

  • Author_Institution
    IBM Microeletronics, Essex Junction, VT, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    1198
  • Abstract
    Over the last 2-3 years, there has been a major change in the IC industry from being predominantly "functional-based testing" to being predominantly "scan-based testing" (for new design starts). The question has now changed to: "can we completely avoid functional testing?" The same trends that are driving companies toward scan-based testing will also drive them to completely avoid functional-based testing. The advantages of structural testing cannot be fully exploited unless at-speed functional testing is avoided. The move away from functional testing will happen in stages. Some companies are already avoiding functional test for some test insertions - but not all. For example, some products are currently tested with scan-based, reduced pincount testing at wafer level - but still require full pincount, scan+functional testing at package test.
  • Keywords
    application specific integrated circuits; automatic testing; boundary scan testing; consumer electronics; integrated circuit testing; ASIC; consumer products; package test; reduced pincount testing; scan-based testing; structural testing; test insertions; wafer level; Application specific integrated circuits; Built-in self-test; Circuit faults; Circuit testing; Consumer products; Cost function; Fault detection; Integrated circuit testing; Logic testing; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2002. Proceedings. International
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-7542-4
  • Type

    conf

  • DOI
    10.1109/TEST.2002.1041905
  • Filename
    1041905